IntelŽ AES New Instructions (IntelŽ AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
IntelŽ Transactional Synchronization Extensions New Instructions (IntelŽ TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software.
IntelŽ Hyper-Threading Technology (IntelŽ HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Added Security with Faster Data Encryption
The IntelŽ Advanced Encryption Standard New Instructions (IntelŽ AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.
Higher Performance When You Need It Most
IntelŽ Turbo Boost Technology 2.01 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.
Simplify Virtualization and Reduce Overheads
IntelŽ Virtualization Technology (IntelŽ VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.
Leading-Edge Security for an Unwired Workplace
The capabilities of IntelŽ vPro technology help IT leadership protect cloud and virtual environments from rootkits and malware threats while ensuring that their organization can keep up with workforce demands. Hardware-based features support centralized image management and administration, secure network storage, and out-of-band protection.
|BLT Item #:||B1BG405|
|Manufacturer Part #:||4XG7A07215|
|Description:||THINKSYSTEM ST550 INTEL XEON SILV 4110 8C 85W 2.1G PROC OPTN KIT (ORDERED AS NEEDED FROM MFG)|
|Suggested Retail Price:||$829.00|
|Dimensions:||10.56" x 8.81" x 7.56"|
|Brand and Item Information|
|Name:||Lenovo 4XG7A07215 2.1GHz 11MB L3 processor|
|Brief Description:||Lenovo 4XG7A07215, IntelŽ XeonŽ, 2.1 GHz, LGA 3647, Server/workstation, 14 nm, 64-bit|
|Expanded Description:||Lenovo 4XG7A07215. Processor family: IntelŽ XeonŽ, Processor frequency: 2.1 GHz, Processor socket: LGA 3647. Memory channels supported by processor: Hexa, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Thermal Design Power (TDP): 85 W, Supported instruction sets: AVX,AVX 2.0,AVX-512,SSE4.2, Processor package size: 76 x 56.5|
|Processor family:||IntelŽ XeonŽ|
|Processor frequency:||2.1 GHz|
|Processor socket:||LGA 3647|
|Processor lithography:||14 nm|
|Processor operating modes:||64-bit|
|Processor cache:||11 MB|
|Processor cache type:||L3|
|Processor boost frequency:||3 GHz|
|Memory channels supported by processor:||Hexa|
|Maximum internal memory supported by processor:||768 GB|
|Memory types supported by processor:||DDR4-SDRAM|
|Memory clock speeds supported by processor:||2400 MHz|
|ECC supported by processor:||Y|
|On-board graphics adapter:||N|
|Processor Special Features|
|IntelŽ Hyper Threading Technology (IntelŽ HT Technology):||Y|
|IntelŽ Turbo Boost Technology:||2.0|
|IntelŽ vPro Technology:||Y|
|IntelŽ AES New Instructions (IntelŽ AES-NI):||Y|
|Intel Trusted Execution Technology:||Y|
|IntelŽ Speed Shift Technology:||Y|
|Intel Virtualization Technology (VT-x):||Y|
|Conflict Free processor:||Y|
|Intel Turbo Boost Max Technology 3.0:||N|
|IntelŽ Optane Memory Ready:||N|
|Thermal Design Power (TDP):||85 W|
|Maximum number of PCI Express lanes:||48|
|PCI Express slots version:||3.0|
|Supported instruction sets:||AVX,AVX 2.0,AVX-512,SSE4.2|
|Processor package size:||76 x 56.5 mm|
|Embedded options available:||Y|