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Lenovo 4XG7A07202 Thinksystem Sr530 Intel Xeon Silver 4112 4c 85w 2.6g Proc Optn K

Lenovo 4XG7A07202 Thinksystem Sr530 Intel Xeon Silver 4112 4c 85w 2.6g Proc Optn K 
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Mfg. & Model:Lenovo 4XG7A07202
Mfg. Part #:4XG7A07202
UPC:
Description:Thinksystem Sr530 Intel Xeon Silver 4112 4c 85w 2.6g Proc Optn K
Price:$738.52
Availability:Limited availability
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Specifications

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Data Sheets
Essential Information
BLT Item #:B1BF870
Mfg. Part #:4XG7A07202
Mfg.:Lenovo
Description:THINKSYSTEM SR530 INTEL XEON SILVER 4112 4C 85W 2.6G PROC OPTN K (SHIPS FROM MFG)
Weight:1 lbs.
Suggested Retail Price:$819.00
Mfg.'s website:Visithttp://www.lenovo.com/
Return Policy:No Returns Or Exchanges
Overview
Brand:Lenovo
Name:Lenovo Intel Xeon Silver 4112 2.6GHz 8.25MB L3 processor
Brief Description:Lenovo Intel Xeon Silver 4112, IntelŽ XeonŽ, 2.6 GHz, LGA 3647, Server/workstation, 14 nm, 64-bit
Expanded Description:Lenovo Intel Xeon Silver 4112. Processor family: IntelŽ XeonŽ, Processor frequency: 2.6 GHz, Processor socket: LGA 3647. Memory channels supported by processor: Hexa, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Thermal Design Power (TDP): 85 W. Scalability: 2S. Processor package size: 76 x 56.5
Processor
Processor family:IntelŽ XeonŽ
Processor frequency:2.6 GHz
Processor cores:4
Processor socket:LGA 3647
Component for:Server/workstation
Processor lithography:14 nm
Processor model:4112
Processor threads:8
Processor operating modes:64-bit
Processor cache:8.25 MB
Processor cache type:L3
Processor boost frequency:3 GHz
Processor codename:Skylake
Memory
Memory channels supported by processor:Hexa
Maximum internal memory supported by processor:768 GB
Memory types supported by processor:DDR4-SDRAM
Memory clock speeds supported by processor:2400 MHz
ECC supported by processor:Y
Weight & Dimensions
Processor package size:76 x 56.5 mm
Power
Thermal Design Power (TDP):85 W
Operational Conditions
Tcase:76 °C
Other Features
Compatibility:Lenovo ThinkSystem SR530
Graphics
On-board graphics adapter:N
Processor Special Features
IntelŽ Hyper Threading Technology (IntelŽ HT Technology):Y
IntelŽ Turbo Boost Technology:2.0
IntelŽ vPro™ Technology:Y
IntelŽ AES New Instructions (IntelŽ AES-NI):Y
Intel Trusted Execution Technology:Y
IntelŽ Speed Shift Technology:Y
Intel TSX-NI:Y
Intel 64:Y
Intel Virtualization Technology (VT-x):Y
Conflict Free processor:Y
Intel Turbo Boost Max Technology 3.0:N
IntelŽ Optane™ Memory Ready:N
Features
Maximum number of PCI Express lanes:48
PCI Express slots version:3.0
Scalability:2S
Embedded options available:N
Certifications
<b>Leading-Edge Security for an Unwired Workplace</b>
The capabilities of IntelŽ vPro™ technology help IT leadership protect cloud and virtual environments from rootkits and malware threats while ensuring that their organization can keep up with workforce demands. Hardware-based features support centralized image management and administration, secure network storage, and out-of-band protection.
<b>Higher Performance When You Need It Most</b>
IntelŽ Turbo Boost Technology 2.01 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.
<b>Added Security with Faster Data Encryption</b>
The IntelŽ Advanced Encryption Standard New Instructions (IntelŽ AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.
<b>Simplify Virtualization and Reduce Overheads</b>
IntelŽ Virtualization Technology (IntelŽ VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.


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